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Latest Journal Article

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Baishya, K., Harvey, D.M, et al. (2020) Manufactured PCB influces Flip-Chip Susceptibility. (pdf)Download
Majid, A.E. and Ekere, N.N. (2020) Crack initiation and growth in PV module interconnection. (pdf)Download

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This project has received funding from the European Union’s Horizon 2020 Research Innovation and Staff Exchange Programme (RISE) under the Marie Skłodowska-Curie Action, Programme H2020-EU.1.3.3. - Stimulating innovation by means of cross-fertilisation of knowledge Grant Agreement No 871163  - https://cordis.europa.eu/project/id/871163


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